Master Bond Product Search

581 products match

EP24 Two Part Epoxy EP24

Fast setting, room temperature curing, high bond strength epoxy adhesive. Easy to apply. Moderate viscosity. Convenient one to one mix ratio. Bonds well to similar/dissimilar substrates. Fine electrical insulation properties. Excellent dimensional stability. Service operating temperature range from -60°F to +250°F.

EP24AN Two Part Epoxy EP24AN

Fast curing two component epoxy adhesive. Outstanding thermal conductivity and electrical insulation properties. Self leveling paste. Easy to apply. High bond strength. Long term durability. Low coefficient of expansion. Superb dimensional stability. Service operating temperature range from -60°F to +250°F.

EP24AO Two Part Epoxy EP24AO

Thermally conductive/electrically insulative epoxy adhesive. Fast curing at ambient temperature. Non-critical equal weight or volume mix ratio. High bond strength. Dimensionally stable. Service operating temperature range from -60°F to +250°F.

EP28

Excellent flowability and unique wetting characteristics. Thermal and electrical insulator. Solvent free two part epoxy system. Cures quickly at room temperature. Exceptionally strong bonds. Serviceable from -60°F to +250°F.

EP29LP Two Component Epoxy EP29LP

Clear, two component epoxy system has long pot life. Convenient one to one mix ratio. High bond strength. Superb chemical resistance properties. Used in bonding, sealing, potting and filament winding applications. Low viscosity compound. Exceptionally low exotherm. Cures rigid. Service operating temperature range from -60°F to +250°F.

EP29LP-1 Two Component Epoxy EP29LP-1

Low viscosity room temperature curing epoxy features long working life and low exotherm. Contains no solvents. Optically clear. High physical strength properties. Versatile cure schedules. Ideal for filament winding and large volume potting. Superior chemical resistance to water, fuels, acids, bases and salts. Serviceable from -100°F to +250°F.

EP29LPAO Two Part Epoxy System EP29LPAO

Thermally conductive/electrically insulative epoxy for large potting/encapsulation applications. Low exotherm. Long working life. Excellent flow properties. Very low shrinkage upon cure. Impressive compressive strength. Shore D hardness 80-90. Serviceable from -60°F to +250°F.

EP29LPAOHT Two Part Epoxy EP29LPAOHT
EP29LPHE Two Component Epoxy EP29LPHE

Low viscosity epoxy for large potting/encapsulation applications. Low modulus, high elongation. Long working life. Exceptionally low shrinkage upon cure. Impressive optical clarity. Low exotherm. Serviceable from -60°F to +250°F.

EP29LPHT Two Part Epoxy System EP29LPHT

Low viscosity, optically clear epoxy for bonding, sealing, potting. Room temperature curing. Superior dielectric properties. Serviceable from -60°F to +300°F. Cures rigid. Long working life. Low shrinkage upon cure. Ideal for large volume potting.

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