Expanded Product List
Master Bond Product Search
609 products match
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EP30AN-1LP Exceptionally high thermal conductivity. Superb electrical insulation properties. Versatile cure schedule. Excellent flowability. Long working life. Rigid bonds. Impressive compressive strength. Serviceable from -60°F to +250°F. |
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EP30ANHT Epoxy bonding, sealing, coating compound. Outstanding thermal conductivity and electrical insulative properties. Low CTE. Good flowability. Ideal for potting/encapsulation. Serviceable from -60°F to +450°F. |
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EP30AO Low viscosity, thermally conductive potting, bonding and sealing compound. Cures at room temperature. Superior electrical insulation properties. High compressive strength. Rigid bonds. Low thermal expansion coefficient. Excellent dimensional stability. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +250°F. |
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EP30AOHT Thermal conductive/electrically insulative epoxy for bonding, potting, sealing, coating. Serviceable from -60°F to +400°F. Low CTE. Rigid bonds. Excellent dielectric strength. Flowable. |
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EP30AOSP Room temperature curing epoxy. Thermally conductive/electrical insulative. Low viscosity with excellent flowability. Suitable for potting and casting. Outstanding chemical resistance. Shore D hardness 90. High compressive strength. Serviceable from -60°F to +250°F. |
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EP30C Two component nickel filled electrically conductive epoxy system. High strength. Resists chemical exposure and thermal cycling. Good heat dissipation. Superior EMI/RFI shielding properties. 100% reactive. Serviceable from -60°F to +250°F. |
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EP30D-10 Optically clear, elastomeric system. Urethane modified epoxy. 100% reactive. Serviceable from -100°F to 220°F. Long working life. Resistant to thermal cycling. High impact strength. Outstanding flexibility. Protects against abrasion. Minimal linear shrinkage upon cure. Low moisture permeability. |
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EP30D-7 Urethane-modified epoxy system. Superior toughness and abrasion resistance. Cures at room temperatures. Compound flows easily and smoothly. Versatile cure schedule. |
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EP30D-7SPHT Urethane-modified epoxy system. Superior toughness and abrasion resistance. Cures at room temperatures. Compound flows easily and smoothly. Versatile cure schedule. |
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EP30DP-NV Two part, room temperature curing, lower viscosity system used primarily for potting and encapsulation applications. Excellent thermal cycling properties along with shock and vibration resistance. Low exotherm and long working life. Superb abrasion resistance and electrical insulation characteristics. Repairable. Serviceable from 4K to +250°F. |