Master Bond Product Search

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EP21QF Two Component Epoxy EP21QF

Two component, moderate viscosity epoxy. The service temperature range is -80°F to +300°F. Color coded for easy mixing. Good physical strength profile.

EP21SC-1 Two Part Epoxy Compound EP21SC-1

High performance, abrasion resistant epoxy system. Silicon carbide filled compound. Convenient one to one mix ratio. Resists thermal cycling and many chemicals. Exceptional bond strength. Low coefficient of thermal expansion. Excellent electrical insulation properties. Paste consistency. Serviceable from -60°F to 250°F.

EP21SL5 Two Part Epoxy EP21SL5

Epoxy adhesive for bonding teak wood and other types of wood. Inique capability of adhering well to oily surfaces. Inert to water and many chemicals. Service temperature range -60°F to 275°F. 100% reactive. High strength. Long term durability.

EP21TCHT-1 Two Part Epoxy Adhesive EP21TCHT-1

Two part, room temperature curable epoxy system with high thermal conductivity. Serviceable from cryogenic temperatures up to +400°F. Electrically isolating. Meets NASA low outgassing specifications. Halogen free. Paste consistency. Formulated to cure at ambient temperatures. Withstands 1,000 hours 85°C/85% RH.

EP21TDC Two Component Epoxy EP21TDC

Superior toughness. Ideal for bonding similar and dissimilar substrates. Withstands aggressive thermal cycling. Convenient one to one mix ratio. Good flow properties. User friendly. Versatile cure schedule. Serviceable from -60°F to +250°F.

EP21TDC-2 Two Part Epoxy EP21TDC-2

Highly flexibilized. Serviceable from 4K to +250°F. Excellent peel strength. Superb thermal and electrical insulator. Good flow. Easy to apply. Low exotherm. Cures at ambient temperature. Variable hardness depending on cure schedule.

EP21TDC-2AN Two Part Epoxy EP21TDC-2AN

Flexibilized. Thermally conductive/electrically insulative. Thermal conductivity 22-24 BTU· in/ft2 hr· °

F. Serviceable from 4K to +250°F. Superb impact resistance. Long working life. High peel strength. Elongatio >25%.

EP21TDC-2AO Two Part Epoxy EP21TDC-2AO

Flexible high performance adhesive, sealant, encapsulant. Excellent heat dissipative properties. High dielectric strength. Long working life. Low exotherm. Elongatio >25%. Bonds well to similar and dissimilar substrates. Serviceable from 4k to +250°F.

EP21TDC-2AOLV Two Part Epoxy Compound EP21TDC-2AOLV

Flexible high performance adhesive, sealant, encapsulant. Excellent heat dissipative properties. High dielectric strength. Long working life. Low exotherm. Elongatio >25%. Low viscosity formulation bonds well to similar and dissimilar substrates. Serviceable from 4K to +250°F.

EP21TDC-2LO Two Part Epoxy EP21TDC-2LO

Highly flexibilized, thermally conductive/electrically insulative epoxy adhesive. High elongation. Exhibits superior shear and peel strength properties. Serviceable from 4K to 250°F. Withstands thermal cycling, thermal shock and mechanical shock. Passes NASA low outgassing test. Cures at room temperature or more quickly at elevated temperatures.

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