Epoxies for Bonding Polyimide

Master Bond offers one and two component adhesive systems for bonding polyimide plastic to polyimide plastic and to dissimilar substrates.

High performance polyimide polymers are noted for their:

  • Thermal stability
  • High tensile and compressive strength
  • Durability
  • Low outgassing properties
  • Toughness
  • Excellent electrical/thermal insulation
  • Ability to endure multiple sterilization cycles
  • Biocompatibility
  • Low coefficient of thermal expansion
  • Lubricity
  • Dimensional stability
  • Lightweight
  • Capability of withstanding chemicals such as bases, acids, solvents, oils, grease
  • Creep resistance
  • Propensity to guard against friction and wear
  • Self-extinguishing characteristics
  • Machinability

Polyimide plastics are used by the following industries:

  • Semiconductor
  • Aerospace
  • Automotive
  • Medical
  • Defense
  • Energy
  • Electronic
  • 3D printing

Specific applications in which polyimide plastics are utilized:

  • Flexible printed circuit boards
  • Motors
  • Transformers
  • Catheters
  • Membrane filters
  • Loudspeaker components
  • High temperature fuel cells
  • Wire and cable insulation
  • Turbines
  • Missiles
  • Photovoltaic modules
  • Flat panel displays
  • Hard disc drive components
  • Electrical connectors
  • Sensors
  • Printer components

For more information on bonding plastic substrates take a look at our surface preparation guide.

Products for Bonding Polyimide

Numerous adhesive grades have been developed by Master Bond Inc. to meet distinct requirements for bonding distinct types of polyimide plastics under divergent environmental conditions. Some common examples of widely employed products are Supreme 10HT, EP21LVMED, Supreme 11AOHT and EP21TCHT-1.

Single component heat curable Supreme 10HT offers excellent physical strength properties. This toughened composition has an “unlimited” working life at room temperature, is NASA low outgassing approved, and cures with heat at around 250-300°F (~ 120-150°C). Two-part room temperature curing epoxy system EP21LVMED offers a convenient 1:1 mix ratio for ease of application and meets the USP Class VI and ISO 10993-5 tests for biocompatibility and cytotoxicity respectively. Supreme 11AOHT is a toughened two component room temperature curable epoxy, which is electrically insulating and thermally conductive. EP21TCHT-1 is a two component, thermally conductive, electrically non-conductive thixotropic paste epoxy, which is cryogenically serviceable and offers low coefficient of thermal expansion.

It is important to note that proper surface preparation is crucial for bonding polyimide plastics, as they can be difficult to bond to due to their low surface energy. The surfaces should be cleaned and thoroughly degreased, before applying the adhesive. Procedures such as plasma treatment may help to improve adhesion. Additionally, appropriate tests should be conducted to ensure the selected adhesive is suitable for the specific usage.

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