EP21ARHTND-2 Product Information

Two Part Epoxy EP21ARHTND-2

Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating System, Featuring Outstanding Chemical Resistance to Acids Along with Higher Temperature Resistance.

EP21LVTK-2 Product Information

Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.

MasterSil 711Med Product Information

MasterSil 711Med Silicone System

One Component, Room Temperature Curing, Silicone Elastomer Adhesive For High Performance Bonding and Sealing; Meets ISO 10993-5

Supreme 11AOHTMed Product Information

Master Bond Supreme 11AOHTMed Epoxy System

Two Component, Room Temperature Curing, Passes ISO 10993-5. Thermally Conductive, Electrically Isolating Epoxy for Bonding and Sealing Featuring High Temperature Resistance along with High Shear and Peel Strength.

MasterSil 913Med Product Information

MasterSil 913Med Silicone System

One Component, Room Temperature Curing Silicone Elastomer Adhesive
for High Performance Bonding and Sealing. Fast Curing and Non-Corrosive.

UV15-7NV-1 Product Information

Master Bond UV15-7NV-1 Polymer System

One Component, Low Viscosity UV Curable Polymer System for High Performance Bonding, Sealing, Coating and Encapsulation, Featuring Excellent Physical Strength Properties and Low Shrinkage Upon Cure.

UV15 Product Information

UV15 One Part UV Curable Compound

Low Viscosity, One Component, UV Curable Epoxy Based System for High Performance Bonding, Coating and Sealing with Exceptional Thermal Stability and Very Low Shrinkage upon Cure.

EP30D-7SPHT Product Information

Flexibilized, Two Component, Room Temperature Curing, Urethane-Modified Epoxy System Featuring Superior Toughness, and Abrasion Resistance for High Performance Bonding, Sealing, Coating and Encapsulation

UV10TK Product Information

One Component, Moderate Viscosity UV Curable System for High Performance Bonding, Sealing and Encapsulating, Featuring Excellent Physical Properties, Dimensional Stability and Chemical Resistance with an Outstanding Tg

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