Low Viscosity Silicone Conformal Coating Featuring Fast Tack-Free Cures, Excellent Protection of Electronic Circuitry in High Humidity Environments as well as Resistance to Shock and Vibration
Flexibilized, One Component Epoxy Adhesive/Sealant Featuring Outstanding Shear and Peel Strength; Serviceable from 4°K to 350°F. Requires Minimum Cure Temperature of 250°F.
Two Component, Room Temperature Curing, Toughened Epoxy Adhesive/Sealant for High Temperature Bonding and Sealing. Offers High Shear and Peel Strength, Along With Convenient Handling.
One Component, No Mix, Toughened Epoxy for Bonding, Sealing and Coating Featuring Very Fast Curing, High Shear and Peel Strength Properties along with Superior Thermal Cycling Capabilities.
One Component, Toughened Epoxy Adhesive, Sealant and Coating Featuring High Shear and High Peel Strengths. Uniquely Special System Cures at 175°F with Superior Adhesive Properties and Outstanding Thermal Cycling Capabilities.
