One and two component systems are designed to meet the needs of medical device manufacturers. These products offer high reliability and can withstand difficult conditions encountered in use. They cure at ambient or elevated temperatures or upon exposure to UV light. For more information on curing requirements, key properties, and service temperature ranges view these charts on biocompatible adhesives.
Learn more about our adhesive systems for the medical industry:
- Diagnostic Equipment
- Disposable and Reusable Devices
- Medical Electronics
- Needle Bonding
- Orthopedic and Prosthetic Devices
Key Benefits of Master Bond Medical Adhesive Systems
- Biocompatibility—USP Class VI approved
- Resistance to sterilization—select compounds resist autoclaving, radiation, ethylene oxide and cold sterilants
- High bond strength to similar and dissimilar substrates
- Solvent free
- Fast curing systems
- Gap filling
- Easily automated
- Optically clear formulations
- Available in a range of hardnesses
- Thermal stability
Special compounds can withstand multiple sterilization cycles.
Some of Our Most Popular Medical Epoxy Adhesives
Low viscosity, two part epoxy with outstanding chemical resistance. Passes USP Class VI biocompatibility tests. Capable of withstanding repeated sterilization cycles including radiation, EtO, chemical sterilants, autoclaving. Serviceable from -60°F to +450°F. Cures at room or elevated temperatures. Available in amber-clear and black colors. Castable in thicknesses up to 2-3 inches.
Biocompatible. Meets USP Class VI test specification. Impressive resistance to chemical sterilants including ethylene oxide, bleach, glutaraldehyde, hydrogen peroxide based systems and paracetic acid type compounds. High bond strength. Electrical insulator. Fast curing. Quick handling time. Service temperature range -60°F to +250°F.
Biocompatible two component epoxy. USP Class VI approved. Low viscosity. Versatile cure schedules. Resists EtO, gamma radiation and cold sterilants. High strength rigid bonds. Serviceable from -60°F to +250°F. Can be used for indirect food contact per 175.105 FDA specification.
Silver conductive epoxy with low volume resistivity and USP Class VI certification. Cures at room temperature or more quickly at elevated temperatures. Durable. Serviceable from 4k to +250°F. Smooth paste. One to one mix ratio by weight or volume. Shore D hardness 50-60. High bond strength.
Rapid curing, one part epoxy. Meets USP Class VI biocompatibility standards. Thixotropic paste viscosity. High shear strength. Superb resistance to autoclaving, chemical sterilants, radition, EtO. Serviceable from -60°F to +400°F.
UV curing system with high flexibility that is biocompatible per USP Class VI testing. Medium viscosity. Superior abrasion resistance. Non-yellowing. Reliable thermal and electrical insulator. Serviceable from -80°F to +250°F.