Master Bond has developed a highly thermally conductive epoxy system that is specially designed to help mitigate the issues associated with tightly packed components and miniaturized electronic circuits.
Master Bond's EP21TDCHT-LO two part epoxy adhesive/sealant is specially formulated for demanding applications where factors like temperature cycling, high vibration, and mechanical shock are an issue. It meets NASA low outgassing specifications. This versatile system is used for a wide variety of structural, electronic, aerospace, medical, and oil & chemical processing applications.
Developed for coating and lining storage tanks, piping, scrubbers, and processing equipment in the chemical industry, Master Bond EP21ARHT features outstanding chemical, fuel, and acid resistance. Also widely used in electronic, electrical, and metalworking industries, it can even successfully withstand immersion to 96-98% sulfuric acid and 20% hydrochloric acid for more than a year.
Master Bond EP65HT-1 combines high temperature resistance and fast room temperature curing in a NASA low outgassing approved epoxy. It also offers superior electrical insulation capabilities and strong chemical resistance.
Combining the benefits of epoxy resins and polyurethanes, Master Bond Polymer System EP30D-7 offers superior strength, flexibility, abrasion resistance and toughness.
