Master Bond Product Search

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EP21TDCHT Two Part Epoxy EP21TDCHT

High strength, high temperature resistant, two part system with excellent bond strength and thermal cycling capabilities. Serviceable from -100°F to +350°F. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Moderate viscosity. Superior toughness. Withstands vibration, impact, shock. Good dimensional stability. Convenient one to one mix ratio. Dependable electrical insulation properties.

EP21TDCHT-1 Two Component Epoxy EP21TDCHT-1

Flexibilized two component epoxy adhesive. Cures at room temperature or more rapidly at elevated temperatures. Forgiving one to one mix ratio. Ideal for bonding substrates with CTE mismatches. Superior chemical resistance. Durable. Service operating temperature range from -100°F to +400°F.

EP21TDCHT-LO Two Component Epoxy Adhesive EP21TDCHT-LO

Two component, toughened epoxy adhesive. High peel strength and shock resistant. NASA low outgassing certified. Convenient one to one mix ratio. Ideal for bonding similar and dissimilar substrates. Withstands 1,000 hours 85°C/85% RH. Serviceable from -100°F to +350°F. Good flow. Easy to apply.

EP21TDCHTND Two Part Epoxy System EP21TDCHTND

Epoxy paste adhesive. Non-drip system. Gap filling. Superior toughness. Withstands rigorous thermal cycling. Impressive bond strength. Serviceable from -100°F to +350°F. Convenient one to one mix ratio. Excellent electrical insulator.

EP21TDCN Two Part Epoixy System EP21TDCN

Nickel conductive epoxy adhesive. Volume resistivity is 5-10 ohm-cm. 100% reactive. Superior toughness. One to one mix ratio by weight or volume. Smooth paste viscosity. Ambient temperature cures or fast elevated temperature cures. Service operating temperature range from -100°F to +275°F. High bond strength.

EP21TDCN-LO Two Part Epoxy System EP21TDCN-LO

Two component nickel conductive epoxy featuring high peel strength, superior toughness and low volume resistivity. Withstands thermal cycling. Meets NASA low outgassing specifications. The service temperature range is -100°F to +275°F.

EP21TDCNFL

Two component nickel conductive epoxy adhesive. High flexibility. Excellent peel strength. Service temperature range from 4K to +250°F. Low shrinkage upon cure. Resists a wide range of chemicals. Volume resistivity 5-10 ohm-cm. Convenient one to one mix ratio by weight or volume.

EP21TDCS Two Part Epoxy EP21TDCS

Two component, silver filled electrically conductive epoxy system with a convenient one to one mix ratio and very low volume resistivity. Cures at room temperature. Superior toughness. Serviceable from 4K to +275°F. Withstands rigorous thermal cycling. Successfully tested for 1,000 hours 85°C/85% RH. Exhibits superb thermal conductivity.

EP21TDCS-LO Two Part Adhesive System EP21TDCS-LO

Silver conductive, room temperature curing epoxy adhesive meets NASA low outgassing specifications. Serviceable from 4K to +275°F. High bond strength properties. Withstands thermal cycling. Outstanding toughness. Volume resistivit <10-3 ohm-cm. Paste viscosity. Convenient one to one mix ratio by weight or volume.

EP21TDCSFL Two Part Conductive Epoxy EP21TDCSFL

SIlver filled electrically conductive epoxy adhesive. Low volume resistivity. Highly flexible. Excellent peel and shear strength. Low linear shrinkage upon cure. Good flow properties. Cures at room temperature. Resists vibration, impact, thermal cycling. Serviceable from 4K to +250°F.

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