Expanded Product List
Master Bond Product Search
609 products match
 |
EP30M4 Potting compound offering low exotherm. Outstanding chemical resistance and electrical insulation properties. Protects against exposure to Skydrol, xylene, 70% sulfuric acid, 98% sulfuric acid, 50% sodium hydroxide and bleach. Cures at ambient temperatures or more quickly at elevated temperatures. |
 |
EP30M4LV Low viscosity epoxy compound for high performance bonding, sealing, casting and potting. Impressive chemical resistance to acids, bases, fuels oils, solvents and water. Low exotherm. Serviceable from -80°F to +250°F. Superior dielectric strength. Shore D hardness 75-85. Excellent adhesion to similar and dissimilar substrates. |
 |
EP30Med Biocompatible two component epoxy. USP Class VI approved. Low viscosity. Versatile cure schedules. Resists EtO, gamma radiation and cold sterilants. High strength rigid bonds. Serviceable from -60°F to +250°F. Can be used for indirect food contact per 175.105 FDA specification. |
 |
EP30ND Light paste. Spreads evenly and smoothly. Superior chemical resistance properties. Cures at room temperatures. Machinable. Service temperature range -60°F to +250°F. High bond strength |
 |
EP30NG Graphene filled epoxy. Non-drip system for bonding and sealing. Cures at room temperature. Superior abrasion resistance. |
 |
EP30NS Moderate viscosity Nanosilica epoxy resin system. High strength rigid bonds. Lower linear shrinkage after cure. Serviceable from -60°F to +300°F. Cures readily at room temperature. Passes ASTM E595 for NASA low outgassing. |
 |
EP30P Two part, room temperature curing epoxy system with excellent optical transparency. Low viscosity. Bonds extremely well to more sensitive plastics such as polycarbonates and acrylics. Superior electrical insulation properties. Good chemical resistance to oils, fuels, water, hydraulic fluids. Serviceable from -60°F to +250°F. |
 |
EP30QF Quartz filled epoxy system. Features high tensile modulus, outstanding compressive strength and superior dimensional stability. Good flow properties. Suitable for potting/encapsulation. Reliable electrical insulator. Low CTE. Service temperature range from -60°F to +250°F. Excellent chemical resistance. Meets NASA low outgassing specifications. Withstands 1,000 hours at 85°C/85% RH. |
 |
EP30TC Thermally conductive epoxy. Can be applied in sections as thin as 5-10 microns. Excellent flow properties. Service temperature range -100°F to +300°F. High compressive strength. Outstanding electrical insulation characteristics. Passes NASA low outgassing tests. Low CTE. |
 |
EP31 Ultra high strength, two part epoxy adhesive that bonds well to most metals and plastics. Aluminum to aluminum lap shear strength exceeds 4,000 psi. T-peel strength >50 pli. Ambient temperature curing. Tough and resilient bonds. Combines low viscosity and optical clarity. Serviceable from -60°F to +250°F. Chemical resistant. First class electrical insulator. |