Expanded Product List
Master Bond Product Search
609 products match
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EP34CA Resists -80°F to +500°F. Two component epoxy system. Long open time. Good flow properties. Can cure in section exceeding 1/4 inch thick. Withstands 1,000 hours 85°C/85% RH. Protects against aggressive chemical exposure. |
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EP34LV Two part moderate viscosity epoxy adhesive, sealant, coating. Features high temperature resistance. Superb electrical insulation properties. Service temperature range -60°F to +450°F. Excellent bond strength. Easily machinable. Successfully tested for 1,000 hours 85°C/85% RH. |
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EP35 High viscosity epoxy adhesive offers excellent thermal stability. Serviceable from -60°F to +450-500°F. Durable. High strength bonds are maintained even after long-term exposures to elevated temperatures. Outstanding resistance to chemical exposure. |
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EP35AOLV Thermally conductive, electrically isolating epoxy serviceable from -60°F to +500°F. Heat curing, good flow. Superior chemical resistance properties. Long pot life. High compressive strength and dimensionally stable. |
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EP35SP High temperature resistant epoxy system. Withstands exposure to aggressive chemicals. Paste viscosity. 100 to 50 mix ratio by weight. Service temperature range -80°F to +550°F. Excellent compatibility with filament winding and bonding composites. |
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EP35SP Type V Tough, high temperature resistant heat curing epoxy adhesive. Service temperature range from -80°F to +500°F. Durable, high strength bonds even after prolonged exposure to high temperatures. Ability to withstand thermal cycling and chemical exposure. |
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EP35TDC Tough, room temperature curing epoxy paste adhesive for high temperature bonding. Serviceable from -60°F to +450-500°F. Non-drip system. Gap filling. Resistant against thermal cycling and chemical exposure. |
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EP36 One part B-staged epoxy. Flexibilized and toughened. Withstands rigorous thermal cycling and thermal shocks. Superb electrical insulation properties. Ideal for potting/encapsulation. Serviceable from -100°F to +500°F. Available in 30 gram cookies. |
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EP36AN Thermally conductive/electrically insulative B-stage epoxy potting/bonding compound. Outstanding toughness and flexibility. Resists up to 500°F. Ability to withstand thermal cycling and impact/vibration. Shore D hardness 80. Volume resistivity 1014 ohm-cm. |
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EP36AO Thermally conductive, electrically insulative B-stage toughened epoxy. One part system. Ideal for potting and encapsulation. Capable of withstanding rigorous thermal shocks. Serviceable from -100°F to +500°F. Available in 30 gram cookies. Meets NASA low outgassing specifications. |