One Component, UV and Heat Curable Epoxy System for High Performance Bonding, Coating and Sealing. Dual Cure System Allows for Curing in “Shadowed Out” Areas at Temperatures as Low as 80°C.
One Component, Epoxy System for Bonding, Sealing and Coating Featuring Very Fast Cure along with High Strength Properties. Meets NASA low outgassing specifications.
Two Component, Room Temperature Curing Epoxy Resin for Bonding, Coating, Sealing and Potting Offers Outstanding Non-Yellowing Characteristics; Featuring Low Viscosity. ISO 10993-5 for cytotoxicity.
Two Component, Addition Cured Silicone for High Performance Bonding and Sealing, Featuring High Temperature Resistance, Excellent Flexibility and Paste Consistency; Self Priming System. Meets ISO 10993-5 Specifications.
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating System, Featuring Outstanding Chemical Resistance to Acids Along with Higher Temperature Resistance.
Two Component, Room Temperature Curing Epoxy System for High Performance Bonding, Sealing and Coating and Encapsulation Featuring Outstanding Physical Properties, Commanding Dimensional Stability, Low Shrinkage Upon Curing and Easy Processing.
Two Component, Room Temperature Curing, Passes ISO 10993-5. Thermally Conductive, Electrically Isolating Epoxy for Bonding and Sealing Featuring High Temperature Resistance along with High Shear and Peel Strength.
One Component, Low Viscosity UV Curable Polymer System for High Performance Bonding, Sealing, Coating and Encapsulation, Featuring Excellent Physical Strength Properties and Low Shrinkage Upon Cure.
