EP21SL5 Product Description

Master Bond Polymer System EP21SL5 is a two component high performance epoxy resin system for bonding teak and other wood products which combines high physical strength properties, remarkable abrasion, thermal shock and heat resistance, inertness to water and many chemicals with outstanding adhesive characteristics. It has a service temperature range from -60°F to over 275° F. This epoxy resin system is an excellent electrical insulator. Master Bond Polymer System EP21SL5 features the unique capability of adhering well to the oily surfaces which makes it ideal for bonding wood such as teak etc. As it is 100% reactive and does not contain any solvents or diluents, shrinkage on cure is minimal.

Master Bond Polymer System EP21SL5 is supplied as a two component material with an easy-to-use non-critical 2:1 mix ratio (weight or volume). It cures readily at ambient temperatures. Optimum storage is at or below 75 F in closed containers for as long as a one year period. This epoxy resin system does not require any special storage conditions. Containers should however be kept closed to avoid contamination from foreign substances. Cleanup of spills and equipment is readily achieved with chlorinated, aromatic or ketone solvents employing proper precautions of ventilation and flammability.