Expanded Product List
Master Bond Product Search
106 products match
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Supreme 10HTS Silver filled system with excellent electrical conductivity and high physical strength properties. One part, heat cured (250-300°F) epoxy. Wide range of serviceability from cryogenic temperatures up to +400°F. Meets NASA low outgassing specifications. Can be applied without sagging or dripping, even on vertical surfaces. Volume resistivit <0.006 ohm-cm. Thermally conductive. Shore D hardnes >75. |
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Supreme 11AOHT-LO Passes NASA low outgassing tests. Thixotropic paste viscosity. Convenient one to one mix ratio by weight or volume. High thermal conductivity. Excellent electrical insulation properties. Dimensionally stable. Withstands 1,000 hours 85°C/85% RH. Toughened system. Ability to resist rigorous thermal cycling. Service temperature range -112°F to +400°F. |
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Supreme 12AOHT-LO One component, heat cure system for bonding, sealing. High strength product. Service operating temperature range from 4K to +500°F (260°C). Resists aggressive thermal cycling and shock. Substantial thermal conductivity of 9-10 BTU in/ft2 hr °F. Smooth thixotropic paste. NASA low outgassing approved. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Withstands 1,000 hours 85°C/85% RH. |
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Supreme 17HT Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties.The service temperature range is from -100°F to +550°F. |
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Supreme 17HTND-2 Master Bond Supreme 17HTND-2 is a one component toughened epoxy for bonding and sealing. It is a paste system with good physical strength properties.The service temperature range is from -100°F to +550°F. |
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Supreme 18TC single component epoxy adhesive features unmatched heat transfer properties. Capable of being applied in bond lines as thin as 10-15 microns. Low coefficient of thermal expansion. Meets NASA low outgassing specifications. Low shrinkage upon curing Operating temperature is 4k to +400°F. |
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Supreme 3 Storage stable one component heat curing epoxy adhesive. Versatile cure schedules. Electrically insulative. Durable system. Resists thermal cycling. Serviceable from -100°F to +250°F. |
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Supreme 3AN One part epoxy adhesive offers exceptional thermal conductivity. Good electrical insulating properties. Cures in 5-10 minutes at 300°F or 20-30 minutes at 250°F. Bonds withstand thermal cycling, vibration, stress fatigue cracking. Serviceable from -100°F to +250°F. |
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Supreme 3ANHT Toughened, single component high temperature resistant thermal conductive adhesive. Good electrical insulative properties. No mixing required. Adhesive bonds well to similar and dissimilar substrates. Thick paste viscosity. Shore D hardnes >75. Serviceable from -100°F to +350°F. |
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Supreme 3ANLV-1 Toughened, single component high temperature resistant thermal conductive adhesive. Good electrical insulative properties. No mixing required. Adhesive bonds well to similar and dissimilar substrates. Flowable viscosity. Shore D hardness 80-90. Serviceable from -100°F to +300°F. |