Learn about our line of UV10 adhesives that meet USP Class VI approval for use in medical device manufacturing. These systems feature unique flow properties, along with optical clarity and fast curing times.
Infographics library presents engineers with a variety of materials that cover topics ranging from product properties to industrial highlights, from "how-to" guides to innovations in adhesive technology, and more. Browse through our library for a look at what Master Bond has to offer.
Master Bond two part epoxy EP62-1AO resists acids, bases and solvents while maintaining excellent strength properties.
Most effective underfill epoxies such as EP29LPTCHT have low viscosities and feature high dimensional stability as well as a low coefficient of thermal expansion.
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F - giving it a higher resistance to elevated temperatures than most polysulfide systems.
Ideal for potting and encapsulation applications, Master Bond Supreme 121AO is a heat curing epoxy featuring excellent thermal conductivity and high temperature resistance. Scroll through this infographic to learn more.
Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses.