Two Component Thermally conductive Polysulfide/Epoxy Adhesive/Sealant For High Performance Bonding and Sealing

Master Bond Polymer Adhesive EP21TPHTAO is a two component thermally conducitve, electrically insulative polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough, flexible bonds and seals which are remarkably resistant to thermal cycling and chemicals including water, oil, fuels and most organic solvents, over the exceptionally wide temperature range of -60°F to 325°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive/sealant is an electrical insulator. Color of part A gray, part B amber. Master Bond EP21TPHTAO adhesive/sealant is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. EP21TPHTAO and related systems have been successfully used as fuel tank sealants for years!

The cured compound fully meets the requirements for polysulfide/epoxy type adhesive/sealants. It is also available as a flowable liquid of moderate viscosity; EP21TPAOLV (viscosity 50,000 cps), or lower viscosity version.