Advanced power and high frequency communications electronics have become more sophisticated. Fabricating and assembling these devices involves carefully selecting the proper adhesives, die attach compounds, glob-top encapsulants, underfills and potting compounds. Engineers must be familiar with how these systems can affect design so that they meet and exceed performance objectives.
Selecting the right adhesive is a balancing act as engineers attempt to find products that meet conflicting end-use and manufacturability requirements. Medical device engineers also have to contend with a strict regulatory environment, and therefore often have the toughest time striking that balance.
For a UV curable adhesives, the cure initiates after exposure to UV light at a wavelength that is specific to the photo-initiator used in the formula. A dual cure adhesive has the UV light cure as the first step in the process, followed by a secondary thermal cure achievable at temperatures as low as 80°C.
The range of performance and processing requirements facing sensor designers and manufacturers is vast. Suitable adhesive systems are readily available to meet those demands.
Specially formulated epoxy systems are capable of maintaining performance at temperatures approaching absolute zero, while delivering the required physical, thermal, and electrical characteristics needed for a specific application. Delve into some select case studies to see how specific cryogenic epoxies are used in a variety of high tech industries and applications.
What are the challenges facing applications that operate at cryogenic temperatures? What effect do these low temperatures have on efforts to bond, seal, coat or encapsulate these applications? In this paper, learn how specialized adhesives meet the performance requirements necessary to maintain the physical, thermal and electrical properties as temperatures approaching absolute zero.