Forming reliable bonds between different materials can be challenging because there can be large variations in CTE's (coefficients of thermal expansion). Adhesive compounds play a critical role in the fabrication of assemblies for electronic, optical and mechanical systems.
Selecting the right adhesive is a balancing act as engineers attempt to find products that meet conflicting end-use and manufacturability requirements. Medical device engineers also have to contend with a strict regulatory environment, and therefore often have the toughest time striking that balance.
The rise of electric vehicles and driver aids along with the proliferation of electronic sensors and safety features point towards continued growth in automotive electronics.
The range of performance and processing requirements facing sensor designers and manufacturers is vast. Suitable adhesive systems are readily available to meet those demands.
Specially formulated epoxy systems are capable of maintaining performance at temperatures approaching absolute zero, while delivering the required physical, thermal, and electrical characteristics needed for a specific application. Delve into some select case studies to see how specific cryogenic epoxies are used in a variety of high tech industries and applications.
For a UV curable adhesive, the cure initiates after exposure to UV light at a wavelength that is specific to the photo-initiator used in the formula. A dual cure adhesive has the UV light cure as the first step in the process, followed by a secondary thermal cure achievable at temperatures as low as 80°C.