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EP17HTDA-1 One Part Epoxy EP17HTDA-1

Single component heat curable epoxy epoxy adhesive/sealant. Non-drip system. Resists up to 525°F. Meets NASA low outgassing specifications. Meets MIL-STD-883J Section 3.5.2 for thermal stability. High lap shear, tensile and compressive strength. Tg of 230-240°C after post cure.

One Part Die Attach Epoxy EP17HTDA-2 EP17HTDA-2

One component, heat cured epoxy for bonding and sealing, as well as die attach applications. Flowable, high viscosity system, cures in 4-5 hours at 300°F or 3-4 hours at 350°F. Post cure to optimize properties. High glass transition temperature. NASA low outgassing approved.

One Part Epoxy EP17HTDM-2 Black EP17HTDM-2 Black

One component, heat cured epoxy for bonding and sealing, as well as die attach applications. Flowable, high viscosity system, cures in 4-6 hours at 300°F or 2-3 hours at 350°F. Post curing at 400°F for 1-2 hours to optimize properties. Limited flow and low exotherm when curing.

EP17HTND-2 One Part, Heat Cure Epoxy EP17HTND-2

Single component heat curable epoxy epoxy adhesive/sealant. Non-drip system. Resists up to 600°F. Meets NASA low outgassing specifications. High lap shear, tensile and compressive strength. Tg of 230-240°C after post cure.

EP17HTND-CCM One Part Epoxy EP17HTND-CCM

Single component heat curable epoxy epoxy adhesive/sealant. Non-drip system. Resists up to 550°F. Meets NASA low outgassing specifications. High lap shear, tensile and compressive strength. Tg of 160-165°C after post cure.

Electrically Conductive Die Attach Epoxy EP17HTS-DA EP17HTS-DA

Silver filled, one part, no mix, die attach epoxy with electrical conductivity and high temperature resistance. It is a silver filled system. This specialty formulation maintains a high Tg of 140-150°C and passes MIL-STD-883J thermal stability requirements at 200°C.

EP17TF One Part Epoxy System EP17TF

One part, heat cured epoxy system. Heat resistant to +550°F. High compressive and tensile shear strength. Excellent toughness and resistance to thermal cycling, shock and vibration. Paste consistency.

EP19HT One Component Epoxy System EP19HT

One component, storage stable epoxy resin system. Viscosity 500-600 cps. Tensile strength over 10,000 psi. Excellent chemical resistance. Thermal stability up to +400°F. Superb electrical insulation properties. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +400°F.

EP19HTFL One Part Epoxy EP19HTFL

Toughened, ultra low viscosity no mix formulation. Shore D hardnes >65. Resists impact and thermal cycling. Light amber clear color. Outstanding physical strength properties. Used for sealing/impregnation of porous surfaces. Serviceable from -60°F to +350°F.

EP19HTLV One Component Epoxy EP19HTLV

Ultra low viscosity, thermally stable high performance system. Tg 125-130°C. Resists water, oils, fuels and most solvents. Superior adhesion to metal and ceramics. "Unlimited" working life at room temperature. Serviceable up to 400°F. Ideal for impregnation of porous surfaces.

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